FABRICATION CAPABILITIES

From concept projects and prototypes, through production in medium-volume,
and large-volume with scheduled releases, we offer you the assistance of our
extensive in-house engineering expertise.   We have a long-standing committment
to collaborating with our customers to achieve the highest end-product value
through optimization in Design for Manufacturability (DFM)

Facility: We manufacture here on-site in the United States
in our 17,800 square foot modern brick building
Location: 1725 Fleetwood Drive, Elgin, IL 60123
20 miles West of Chicago / O'Hare Airport...
Markets Served: Military and Aerospace technology
Scientific and Biomedical equipment
Universities and Research Facilities
Independent/individual Project Engineers
Transportation Systems electronics
Industrial Controls / Process Automation
Computers/Peripherals/DataComm
Telecommunications products
Commercial Food Processing equipment
Audio/Video Electronics
Contract Assembly Service companies
plus others...
Design Data Capabilities: Gerber (RS-274D); Extended (RS-274X)
Excellon NC Drill/Route
DXF/PDF/HPGL (other formats - please contact us)
Also check our Technical Reference page
for background information and sources
of software applications and converters.
Fabrication Capabilities: No size too small - or too large! (material-dependent)
Single and Double-Sided
Multilayers (rigid - to 32 Layers)
FLEXIBLE Circuits: Single/Double/Multilayer
RIGID/FLEX Multilayers (to 24 Layers)
'Exotics:' Microwave / Teflon / Ceramics
No-outgassing,   plus new materials ...
Circuit Density / Pitch: .003" (3 mil) line width and spacing
.007" minimum finished hole size
Heavy copper weights/thicknesses
Surface Finishes: Hot Air Solder-leveling -
  Solder Mask Over Bare Copper
  ...or Solder Reflow
  ...both tin-lead and RoHS (lead-free)
Hot Oil Reflow
Plating: Tin, Nickel, Sliver, and Gold
Omikron® Immersion 'White' Tin Carbon and Linear Carbon inks
Solder Masks: Screened Epoxy - various colors and glosses
Color-mixing/matching for custom needs
Liquid Photo-Imageable
Dry Film (vacuum-coated)
Quality / Environmental: 100% Full Inspection at several process points
Inner-layer X-Ray equipment
Bare-board Electrical Testing (for shorts/opens)
Netlist and Flying Probe testing also available
Laboratory for process monitoring
IEPA Class 'K' Licensed Chemist on-site
Ion Exchange wastewater processing
Lead Time: Per Customer Requirements
Sales Terms: Net 30 days or Credit Card    



FLEXIBLE AND RIGID FLEX CAPABILITIES

Flex circuits require a uniquely different perspective in comparison to rigid interconnect systems.
In many ways, the principles which make for good flex construction and reliability may seem
'inside-out' to even the most seasoned rigid board designers.   And just when you think you've
gained some 'flex'-pertise... then come issues like stiffeners and break-away palletizations!

With our expanding in-house capabilites, BRIGITFLEX can offer you all of these process options:

Materials:

sourced from Arlon®, Rogers®, Taconic®, Kaneka®, Oak/Matsushi®, and more...
Polyimide
Teflon / PTFE
High-speed (Low-loss)
High-speed interconnect
Rubber
Rigid Air-flex
Adhesiveless
No Outgassing materials

Substrate thickness: 10 microns and up...

Layer structures:

Single-sided
Double-sided
Multilayer Flex - our specialty!

Pitch/Line spacing: .003 / .003 and up (design-dependent)

Copper weights: ¼, ½, 1, 2-oz and up...

Through-hole formation: Plasma Etch / De-Smear

Finishes: Bare Copper
Omikron® White Immersion Tin
SMOBC / Hot-Air Solder Leveled
Solder Reflow
Hot Oil
Plated metals: Silver; Gold ; other... Carbon and Linear Carbon inks

Mask / Coverlay: Dry Film Photoimageable
Imide LPI
Machined coverlayer

Stiffeners: any user-specified thickness, top, bottom, or both

Fabrication: Routed or Die cut - individual or in arrays
Assembly process arrays - frame / piloting / fiducials
Complex break-away designs - with stiffeners
Rigid Flex 'Bookbinders' ; custom work




PRINTED CIRCUITS

copyright © 2009 Brigitflex, Inc.