Process Capabilities
We will experiment to achieve results needed with materials. Some development projects done include pattern-plating on 3-dimentinal surfaces, thickness down to 10 microns, huge multi-dielectrics very heavy copper .062 inner and one inch thick boards. We are asked to make special light weight air dielectric boards or special caviety pressing process with sequential lamination using active and passive components. Materials including RF, LowLoss, DK, HighSpeed, Foam, Teflon, Kapton, Pyrex & BoraSilca Glass, Thin Film, LCP to name a few.
Gerber (RS-2740) Extended (RS-274X), DXF/PDF - for other formats contact us.
Class 10,000 clean room, spray booth, oversides tables at 96x59. Single - double size large atenna bds. We have oversized equipment to handle, carry and move large panels.
Driller/Router, Magnaflux x-ray system, Beveling and Scoring capabilities. Plasma etch/de-smear unit.
Large vacuum press, 6 openings 24x36, Fusion press, large 6 opening Wabash press at 24x32.
Electrolless, Electoplating, Black Oxide alternative oxide, 60" etcher/developer.
Blue M ovens, epoxy solder masks - all colors, machined solder mask, dry film, liquid photoimageable.
Full machine shop including welding equipment.
EnviroPure Ion Exchange System, Full-time IEPA Class K Licensed Operator, Cross section equipment.
With over 40 years manufacturing expertise, let Brigitflex bring your circuit board concept to reality.